Wafer Backgrinding Tape

Product:​

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• STG-U Series-UV Type

• STG-B Series- Non UV High Adhesive Tape
   

Application:

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• Semiconductor/LED chip cutting

• Filter laser cutting

• MLCC Cutting

• Glass OGS acid-proof process

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Features:

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• Prevent wafer contamination

• Reduce water seepage during wafer grinding

• Excellent wafer TTV effect

• Reduce wafer processing defects such as chip breakage and warping​