Semiconductor | Bye Polymer Material

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BYE Polymer Materials Co.

Semiconductors

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Wafer Backgrinding Tape

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Wafer Dicing Tape

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Package Saw Tape

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QFN/DFN Tape

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High temperature resistant PI tape

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Thermal De-adhesion Tape

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PO (Polyolefin) Substrate

Contact

321-704-3529

Kunshanbye@gmail.com

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