Package Saw Tape

Product:​

​

• STP-1610-UV 
  STP-1720-UV

• ​

Application:

​

• IC/LED substrate packaging cutting

• MEMS packaging cutting

• Glass substrate laser cutting

​

Features:

​

• Suitable for difficult-to-bond materials

• Prevent chip glue residue

• Reduce chip cutting back failure

• Excellent UV removal effect