Halogen-free PI Thermal-pressed Cover Film

Description:

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Halogen-free thermal-pressed PI covering film is made of PI or flame-retardant PET, coated with modified thermosetting adhesive and laminated with release film. It has excellent adhesion to polar interfaces such as tin-plated copper, nickel-plated copper, T2 pure copper, epoxy board, aluminum, and electrophoretic steel.  

Application:

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Suitable for insulation bonding of laminated busbars and liquid cooling plates of power battery modules. It is a flexible material with excellent flame retardancy, high insulation, high temperature resistance and high reliability of electrolyte resistance.

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